REALTIME NEWS

SMIC and GAPT cooperate on flip-chip packaging

Complied from outside sources, Shanghai

Apr 8, 2004, 17:26 0

China-based Global Advanced Packaging Technology (GAPT) is cooperating with Semiconductor Manufacturing International Corporation (SMIC) to set up a flip-chip packaging line in China, according to industry sources. The move is said to herald the maturing of...

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