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Chipbond orders Ultratech lithography system for 300mm solder bump ramp

Press release, May 1; Rodney Chan, DIGITIMES Asia Tuesday 1 May 2007 0

Ultratech, a supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, has announced that Chipbond Technology, one of the world's largest gold-bump foundries, has ordered Ultratech's Unity AP300...

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