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Kinsus expected to see CSP substrate sales to grow stronger in 2008

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia 0

As leading chip vendors are growing their proportion of flip-chip chip-scale packaging (FC-CSP) substrates, investors are projecting that Kinsus Interconnect Technology should see its overall CSP-type substrate sales grow stronger in 2008.

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