Samsung 512Mb MCP PRAM
Samsung Electronics has announced what it claims is the industry's first multi-chip package...
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Hynix 44nm 2Gb DDR2 for mobile applications
Hynix Semiconductor has developed 2-gigabit (2Gb) low-power DDR2 DRAM for mobile applications...
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Taiwan-based HCMF Group, a long-standing supplier of automotive parts and systems to global Tier 1...
"EMS Watch" is a series of articles that analyze the dynamic landscape of global EMS and ODM firms, diving deep into ranking changes, strategic positioning,...
Global investment plans of Japanese IDMs
Geopolitical tensions prompt Japanese IDMs to gather capacities in Japan's Kyushu and Tohoku regions and prioritize their OSAT...
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...
