300mm wafer from UMC with 11 copper layers
SemiTech Taipei 2006: UMC showcases a 300mm wafer with 11 copper layers, manufactured on...
Photo: Vyacheslav Sobolev, DigiTimes
SEMICON Taiwan: Hermes Liu, UMC.
SEMICON Taiwan: Hermes Liu from UMC delivering his presentation "Microloop brings foundry...
Photo: Vyacheslav Sobolev, DigiTimes
As Microsoft transitions from a software giant to a cloud leader, with its cloud business now accounting...
TSMC founder Morris Chang's second autobiography volume unveils a tapestry of milestones, including his influential comeback, rekindled alliances with...
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...
Automotive CIS tech development, 2024
The popularization of autonomous driving is boosting demand for automotive CIS with LFM and HDR being mainstream development...
