Displaying photos tagged packaging [back to index]
Samsung 128GB TSV DDR4 RDIMM
Wednesday 9 December 2015
Samsung Electronics has announced that it is mass producing what it calls the industry's...
Photo: Company
IMEC EUV sensor dies
Thursday 13 October 2011
IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies...
Photo: Company
Applied Producer InVia dielectric deposition system
Wednesday 31 March 2010
Applied Materials has added to its line of 3D chip packaging solutions with the launch of...
Photo: Company
Samsung 0.6mm-thick multi-chip memory package
Tuesday 10 November 2009
Samsung Electronics has developed what it claims is the world's thinnest multi-die package,...
Photo: Company
Finetech Japan 2009: Ito Electronics' water-proof OLED display
Tuesday 21 April 2009
Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009...
Photo: Jessie Lin, Digitimes
