Samsung Electronics has announced today its new near field communications (NFC) chip with embedded flash memory for next-generation smartphones. Mass production is slated for the first quarter of 2011.
The new Samsung NFC chip adopts flash for the embedded memory which allows device designers to easily to upgrade software or firmware. Samsung also provides a software protocol stack and technology services for antenna design and tuning. Through such features and support, designers can reduce their product's time-to-market, the vendor said.
Samsung claimed it developed this NFC chip to have minimal power consumption in both active and stand-by mode. With a 20% decrease in power consumption, Samsung's NFC chip remains active for mobile payment even without battery power.
NFC is a short-range (up to 10cm or four inches), high frequency wireless communication technology which allows devices such as smartphones to collect or transmit data to another NFC-enabled device without manual configuration to identify devices. In addition, NFC chip can play a role as a contactless smartcard in use for public transportation payments for bus and subway fares and mobile banking payments. It can also read RFID tags in retail stores or on outdoor billboards for convenient on-the-spot data access.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
FuriosaAI, a Seoul-based AI chip startup founded in 2017, is making waves in the AI hardware market...
From groundbreaking satellite advancements to international collaboration on space exploration, DIGITIMES Asia delivers comprehensive coverage of TASTI...
Global investment plans of Japanese IDMs
Geopolitical tensions prompt Japanese IDMs to gather capacities in Japan's Kyushu and Tohoku regions and prioritize their OSAT...
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...