If you define mixed signal as being where more than 30% of a die is doing analog or RF work, we are seeing a dramatic rise in mixed-signal designs. Over the next year, it has been said that mixed-signal designs will account for about 70%-80% of designs on all process nodes down to 22nm (according to Mentor Graphics). These analog parts of the designs include functions like multiple clocks in application processors; or HDMI, USB and SerDes in I/O circuits. These types of functionality are taking up an increasing part of the die and changing the rules of the game. It used to be that digital would first go to volume production on a manufacturing node and when the node matures, analog would follow. Now analog had to go to volume at the same time as digital. There is no choice when they are all on the same die.
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- Silicon photonics set for takeoff (Oct 30) - EE Times
- TikTok founder becomes China's richest man (Nov 1) - BBC News
- Nvidia to take Intel's spot on Dow Jones Industrial Average (Nov 1) - Reuters
- Huawei's latest AI processors were made by TSMC (Oct 22) - Bloomberg
- Arm to scrap Qualcomm chip design license in feud escalation (Oct 23) - Bloomberg
- Embedded World brings 3,500 visitors to 1st US outing (Oct 11) - EE Times
- Preparing electronics engineering students for industry (Oct 8) - EETimes Europe
- Former Apple hardware chief Dan Riccio is retiring (Oct 11) - Ars Technica
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