Oded Lendner, vice president, K&S worldwide operations, talks about IC packaging equipment purchase

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Photo gallery

Where am I?

Photo: Amy Lee, DigiTimes

Wednesday 14 September 2005

Lendner speaks at a recent event, saying the strong demand for IC wire bonder from 2Q-3Q boosted K&S's amount of orders.

Tags

Nishant Arya

Monday 7 February 2022

Nishant Arya, Vice Chairman, JBM Group
Photo: Company

Samsung HKMG DDR5

Wednesday 26 May 2021

Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company

Nvidia GeForce RTX 30 series GPUs

Tuesday 3 November 2020

Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company

Apple HomePod mini

Tuesday 3 November 2020

Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company

Apple 13-inch MacBook Pro with Magic Keyboard

Wednesday 21 October 2020

Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company

Apple iPad Pros

Monday 30 March 2020

Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company

Skymizer CTO: Taiwan's AI edge goes beyond data center hardware
Starting from AI compilers and now officially transforming into a chip IP supplier, Skymizer recently...

Computex 2025
Computex 2025 is set to take place from May 20 to 23 at the Taipei Nangang Exhibition Center (TaiNEX), Halls 1 and 2. This year's event continues the...