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Friday 22 May 2026
Tech Forum 2026: Starlink dominates LEO internet market as telecoms shift strategy

At DIGITIMES' Tech Forum 2026 this week, analysts said satellite-based internet services are rapidly emerging as one of the most fiercely...

Thursday 21 May 2026
Tech Forum 2026: Taiwan must design space, not just build it
At DIGITIMES' Tech Forum 2026 this week, Taiwan's top space official delivered a blunt assessment of the island's growing role in the global space economy: Taiwan has become...
Thursday 21 May 2026
From anti-jamming drones to tumor-on-a-chip: Taiwan deep-tech courts Silicon Valley capital
Four Taiwanese deep-tech startups took the stage on the second day of the Plug and Play Silicon Valley May Summit, pitching to international investors and corporations in a session...
Thursday 21 May 2026
SpaceX IPO reveals Musk's US$4 billion AI gamble
SpaceX's long-awaited initial public offering filing landed on Wednesday with all the spectacle investors expected from Elon Musk — and all the contradictions that have come...
Thursday 21 May 2026
From US$10m to US$2.2bn in 17 months: Starcloud bets on orbital fix for AI's energy crisis
Philip Johnston, co-founder and CEO of Starcloud, opened the second day of the Plug and Play Silicon Valley May Summit in Sunnyvale with a proposition that would have sounded implausible...
Wednesday 20 May 2026
SpaceX to purchase Cursor one month after potentially record-breaking IPO
SpaceX plans to follow through with its acquisition of Cursor, which provides AI coding tools, 30 days after the space company launches its IPO. The deal, worth US$60 billion, would...
Wednesday 20 May 2026
Aerospace fastener demand extends into multi-year cycle as NAFCO expands Malaysia capacity amid Boeing ramp-up
Taiwan-based aerospace engine fastener maker National Aerospace Fasteners Corporation (NAFCO) said order visibility has extended to as long as eight to nine years as Boeing accelerates...
Wednesday 20 May 2026
South Korea turns defense contracts into quantum's commercialization launchpad
South Korea's leading defense contractor, LIG Defense & Aerospace, and the state-backed Agency for Defense Development are accelerating efforts to move quantum defense technologies...
Wednesday 20 May 2026
Inside the LEO boom: How Starlink and rivals are reshaping global PCB supply chains
The global satellite communications industry is accelerating the deployment of next-generation infrastructure, unlocking the commercial potential of low-Earth-orbit (LEO) networks,...
Tuesday 19 May 2026
SpaceX listing buzz sends Taiwan's satellite suppliers into expansion mode

As the world races to build next-generation communications networks in low-Earth orbit (LEO), signs are emerging that Elon Musk's SpaceX...

Tuesday 19 May 2026
Satellite communications boom drives Winsemi, AWSC into W band
SpaceX's IPO preparations are accelerating the commercialization of low-Earth orbit (LEO) satellites, renewing global attention on satellite communications. The LEO sector's sharp...
Saturday 16 May 2026
Column: Orbit are now battlefields—how the world's powers are militarizing space
In April 2024, the People's Liberation Army (PLA) executed one of the most significant overhauls of its military architecture in decades. The former Strategic Support Force was disbanded...
Friday 15 May 2026
Column: The new space arms race is being fought with AI, lasers, and autonomous satellites
The emerging space arms race toward 2030 is no longer defined simply by the number of satellites nations can launch into orbit. Increasingly, it is being shaped by breakthroughs in...
Wednesday 13 May 2026
SpaceX pushes toward global launch network for rapid Starship operations
SpaceX is exploring potential sites in the US and overseas to build new "spaceports," CEO Elon Musk said on X on May 12, as the company prepares for a future in which its Starship...
Wednesday 13 May 2026
Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...