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Samsung announces new multi-chip packaged memory

Compiled from outside sources by Iliad Kang, Research Center; Heidi Chu, DIGITIMES Asia Monday 25 December 2000 0

On December 21, Samsung announced that it has developed a multi-chip packaged (MCP) device with eight megabits of full-CMOS (complementary metal oxide semiconductor) SRAM and 64 megabits of read-while-write (RWW) NOR flash in a single package. It plans...

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