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SPIL moves up to 12-inch wafer solder bumping

Carol C.Y. Hsu, Hsinchu; Noah Sauve, DIGITIMES Asia Tuesday 5 February 2002 0

Silicon Precision Industries (SPIL) and Xilinx jointly announced the successful development of 12-inch wafer solder bumping for flip-chip packaging. With Xilinx as technology partner, SPIL began to run its fully-automated, 12-inch wafer solder bumping...

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