CONNECT WITH US

Tripod to invest NT$780 million in CSP substrate production in 2004

Amy Lee, Taipei; Jack Lu, DIGITIMES Asia 0

Anticipating the transition from DDR to DDR2 will stimulate demand for CSP (chip-scale package) substrates, Taiwanese PCB maker Tripod Technology plans to invest NT$780 million (about US$23 million) to build a CSP substrate production line in Taiwan,...

The article requires paid subscription. Subscribe Now