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FlipChip International breaks ground on China joint venture for wafer level packaging with Millennium Microtech Shanghai

Press release, February 13; Stephen Taylor, DIGITIMES Asia Monday 13 February 2006 0

FlipChip International (FCI) on February 10 in Shanghai announced that it started construction of an advanced bumping facility for a new joint venture (JV) in China with Millennium Microtech, Shanghai (MMS). The JV will be referred to as FCMS and it...

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