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Ardentec to secure bank loan for 12-inch wafer and LCD-driver-IC probing expansion

EDN, March 30; Esther Lam, DIGITIMES Asia Thursday 30 March 2006 0

Ardentec will sign a NT$2 billion bank loan next week to fund wafer probing for 12-inch wafers and LCD-driver ICs, according to a Chinese-language Economic Daily News (EDN) report.

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