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Qimonda expands foundry agreement with Winbond

Press release, August 29; Rodney Chan, DIGITIMES Asia Tuesday 29 August 2006 0

Qimonda and Winbond Electronics today announced that they have signed an agreement to expand their existing cooperation on the production of standard memory chips (DRAMs).

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DotDot Global joins forces with AWS JIC to target global markets with food service technology

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