Packaging and testing houses not ruling out price increases for COF process, driver IC design houses to follow suit

Ingrid Lee, Taipei; Carrie Yu, DIGITIMES Asia Thursday 17 May 2007 0

International Semiconductor Technology (IST) and Chipbond Technology, Taiwan-based packaging and testing houses, recently said they are not ruling out increases in prices for chip-on-film (COF) process production in the third quarter 2007 amid strong...

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