Lextar to debut white chip LED featuring substrate-free flip chip and phosphor molding process

Press release; Alex Wolfgram, DIGITIMES Asia Tuesday 1 April 2014 0

Lextar Electronics will debut a package-free "white chip" LED technology that features substrate-free flip chip and phosphor molding process, and can be fabricated by current SMT equipment. The white chip is a chip scale die without packaging...

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