Apple is expected to launch its new iPhones soon, but it seems few would expect strong sales or major spec upgrades for the new phones. News from the supply chain has claimed that PCB order momentum ahead of the new iPhone launch has been weaker than that seen in previous years. But others in the 3D sensing components segment reportedly are receiving a boost from shipments for the upcoming iPhone.
Orders for upcoming iPhones conservative, say PCB firms: Orders for the iPhones slated for launch in September have thus far been weaker compared to the momentum in previous years, according to sources at PCB makers.
Win Semi, Xintec and ShunSin ramping up shipments for 3D sensing components: GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter of 2019, according to industry sources.