Toshiba has launched a new line-up of NAND flash memory products for embedded applications that are compatible with the Serial Peripheral Interface (SPI).
Wide ranging applications for the new Serial Interface NAND include such consumer applications as flat-screen TVs, printers and wearable devices, and industrial applications, including robots. Users can choose from a line-up of 12 products that offers three densities, 1Gbit, 2Gbit and 4Gbit; two packages, WSON and SOP; and two power supply voltages.
Compatibility with the SPI, which can be controlled with just six pins, allows the new Serial Interface NAND to be used as SLC NAND flash memory, with a low pin count, small package and large capacity.
NOR flash memory is typically used in embedded applications for consumer and industrial devices. However, in order to realize extra functionality in embedded devices, demand is growing for larger memory densities for saving software (including boot up programs, firmware, and embedded OS) and data (including log data). This is driving demand for SLC NAND flash memory, which offers higher density and reliability and a lower bit cost than NOR flash memory.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
As Microsoft transitions from a software giant to a cloud leader, with its cloud business now accounting...
From groundbreaking satellite advancements to international collaboration on space exploration, DIGITIMES Asia delivers comprehensive coverage of TASTI...
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...
Automotive CIS tech development, 2024
The popularization of autonomous driving is boosting demand for automotive CIS with LFM and HDR being mainstream development...