BenQ-Siemens unveiled the three handsets carrying the new joint brand name for the first time - the EF81, S68 and S88. All feature a slim design and premium metallic finish but it is the EF81 in particular that provides an indication of the future roadmap: miniaturization of high speed UMTS technology in an ultra thin magnesium clamshell design.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
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Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
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Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
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Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
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Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
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As MWC 2025 concluded, industry observers are focusing on the evolution of next-generation communication...
The 2025 Mobile World Congress (MWC 2025) was held in Barcelona, Spain, from March 3 to March 6. A gathering for industry leaders and members of the...
Tesla AI development in EVs and robots
Tesla leads the trend of automakers deploying humanoid robots, with reducing labor workforce as the initial goal.
India 5G market and development, 2025
India is rising to become a major 5G nation and a growth driver for the global telecom market in 2025.
Global investment plans of Japanese IDMs
Geopolitical tensions prompt Japanese IDMs to gather capacities in Japan's Kyushu and Tohoku regions and prioritize their OSAT...