Powerchip Technology's planned sale of individual production equipment installed at its P3 12-inch wafer fab has come to a conclusion, with 10 companies looking to make their purchases...
Taiwan-based ProMOS Technologies announced on March 28 that the company has agreed with Globalfoundries on the sale of more than 1,000 items of production equipment installed at its...
Globalfoundries and Texas Instruments (TI) reportedly have defeated a group of Taiwan-based niche memory chip providers to win the rights for the purchase of a major portion of the...
Globalfoundries and Texas Instruments (TI) have both provided offers to acquire part of the equipment installed at Powerchp Technology's P3 12-inch plant, bringing uncertainty to...
Elite Semiconductor Memory Technology (ESMT), a Taiwan-based provider of niche-market memory chips, has announced plans to buy part of the facilities at one of Powerchip Technology's...
ProMOS Technologies failed, for the second time, on December 12 to sell its 12-inch fab located in Taichung, central Taiwan, through an open bid despite offerings from Vanguard International...
Mirle Automation reportedly is accelerating its talks with two major China-based panel makers in order to ink TFT LCD equipment supply contracts for 2013. The equipment maker is also...
ProMOS Technologies was originally scheduled to determine a buyer for its 12-inch fab located in Taichung, central Taiwan, in an open bid held today (November 29). However, as bidders...
ProMOS Technologies will hold an open bid to liquidate its 12-inch fab at the Central Taiwan Science Park (CTSP) on November 29. Some industry watchers believe that Vanguard International...
Powerchip Technology may tear down its P3 12-inch fab and sell the production equipment and land separately if it cannot liquidate the plant in one lot. Potential buyers including...
Faced with increased competition from Powerchip Technology in the LCD driver IC foundry sector, Vanguard International Semiconductor (VIS) is actively pursuing a bid to acquire ProMOS...
ProMOS Technologies has announced plans to sell its 12-inch wafer plant and related facilities through open bidding by the end of 2012, in a move to become a fabless memory-IC comp...
LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...
Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...