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NEWS TAGGED 3.75G
Wednesday 9 November 2011
MStar taping out 3.75G handset solutions in 4Q11
Taiwan-based IC design house MStar Semiconductor will begin to tape out 3.75G handset solutions supporting TD-SCDMA and CDMA technologies soon with end market devices to hit the market...
Thursday 13 October 2011
Orders for MediaTek 3.75G smartphone chip soaring
China's brand-name handset vendors, including Lenovo, ZTE and TCL, have ordered more MT6573 3.75G smartphone chips from MediaTek, according to industry sources. To meet the continued...
Wednesday 16 March 2011
Taiwan market: FET plans to add 1,500 HSPA+ base stations in 2011
Taiwan-based mobile telecom carrier Far EasTone Telecommunications (FET) plans to expand its HSPA+ (3.75G) network by adding 1,500 base stations in main cities to bring the total...
Wednesday 2 March 2011
MediaTek begins shipping 3.75G handset solutions, says paper
MediaTek has begun shipping its 3.75G (HSPA+) handset solutions and will venture into the chipset solutions for tablet PCs in 2011, according to a Chinese-language Commercial...
Friday 21 January 2011
Vibo Telecom to set up HSPA+ network in Taiwan, cooperate with Palau Mobile
Vibo Telecom has said it will establish HSPA+ (3.75G) infrastructure in Taiwan as soon as possible in 2011 and has signed an MOU with Palau Mobile Corporation for seven-year cooperation...
Monday 27 September 2010
Taiwan market: Vibo to complete HSPA+ core network in November
Taiwan 3G mobile telecom carrier Vibo is upgrading its core network from the existing 3G equipment supplied by Ericsson to HSPA+ (3.75G) equipment supplied by Nokia Siemens Networks,...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research