The supply of 4G SoCs and PA components for both 4G and 5G models are falling short of demand, but may ease by the end of 2020, according to IC distribution sources.
Pure-play foundry United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the third quarter of 2020, with its capacity utilization rate remaining...
Soitec has announced a business agreement with Qualcomm Technologies on the supply of piezoelectric-on-insulator (POI) engineered substrates for 4G and 5G RF filters. Soitec's piezoelectric-on-insulator...
The year 2020 may become the watershed in the evolution of global supply chains with regionalization and demassification in high gear posing major changes to the world, and the semiconductor...
Huawei/HiSilicon will commercialize a new NB-IoT chipset, dubbed Boudica 200, by the end of 2020, which will support 3GPP R15 standards and offer lower latencies and more integrated...
To improve 5G spectrum's usage efficiency, 3GPP has brought up several solutions with dynamic spectrum sharing (DSS) being one of the major technologies expected to be used when transitioning...
Smartphone AP shipments in China reached a total of 197 million units in the fourth quarter of 2019, down 5.9% on year and 7.7% sequentially with volume for the whole year arriving...
Handset replacements are facing increasing postponement pressure in the China market due to the coronavirus outbreak, posing a big challenge to first-quarter 2020 revenue performances...
China's smartphone market declined 15% to 85.3 million units in the fourth quarter of 2019, which marked the 11th consecutive quarterly decline and hit the market's lowest level since...
