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NEWS TAGGED ADVANTEST
Friday 1 April 2022
ChipMOS, Chipbond to boost OLED DDI testing capacity by 15%
Taiwan-based display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies plan to procure additional high-end testing equipment, mainly from Japan's...
Thursday 20 January 2022
Chipbond, ChipMOS to raise backend quotes by 10-20% in 1Q22
Display driver IC (DDI) backend houses Chipbond Technology and ChipMOS Technologies both plan to raise their quotes by 10-20% later in the first quarter of 2022, according to industry...
Tuesday 11 January 2022
OLED DDI demand to boom for handset, automotive applications in 2022
OLED display drive IC (DDI) demand for handset and automotive applications is set to grow sharply in 2022 allowing DDI backend specialists ChipMos Technologies and Chipbond Technology...
Monday 10 January 2022
Advantest introduces new testing solutions for next-gen IC, high-end CIS
Japan-based semiconductor testing equipment supplier Advantest is introducing new testing solutions for next-generation memory, NAND flash and high-end CMOS image sensors (CIS) as...
Monday 10 January 2022
Lead times for high-end SoC testers extend to over 6 months, says Advantest
It will take at least six months for Advantest to deliver its high-end SoC testing equipment as shortage of key chip components needed to power the equipment has constrained the company's...
Tuesday 14 September 2021
DDI backend houses to strengthen high-end testing capacity expansions in 2022
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Wednesday 4 August 2021
Testing houses to see strong 1Q22
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec are all expected to post a particularly strong first quarter of 2022, as...
Thursday 22 July 2021
HiSilicon faces difficulty gaining manufacturing support for OLED DDI
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Wednesday 17 February 2021
Backend houses to thrive on strong demand for 5G, Wi-Fi 6 chips in 2021
Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...
Tuesday 10 November 2020
Driver IC backend firms see clear order visibility through 1H21
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies have enjoyed a ramp-up in orders for handset-use TDDI chips, with clear order visibility...
Monday 26 October 2020
Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
Monday 6 April 2020
Wafer-level memory burn-in test crucial for cutting backend cost
With the advent of the 5G era, global DRAM bit-based consumption is expected to approximately double by 2023, and wafer-level memory burn-in test services will become increasingly...
Wednesday 18 September 2019
Advantest showcasing new test solutions for 5G, automotive and memory
Semiconductor test equipment supplier Advantest is presenting its latest solutions for 5G, next-generation memory, automotive and power device applications during the Semicon Taiwan...
Thursday 29 August 2019
Advantest positive about testing demand for 5G SoC, memory
Testing demand for high-end 5G SoCs has emerged and that for memory chips is set to pick up in early 2020, which will drive revenue increases at Advantest, a major Japan-based supplier...
Tuesday 16 July 2019
Advantest and MultiLane introduce plugable high-speed test instruments for the V93000 platform
Leading semiconductor test equipment supplier Advantest Corporation has partnered with MultiLane Inc. to develop instrumentation that extends the V93000 platform's ability to cost-effectively...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research