Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...
Taiwan's handset components supply chain is likely to feel the pinch of inventory corrections by Chinese handset vendors starting third-quarter 2021 at the earliest amid their sales...
Samsung Electronics has released its new 5G smartphones, the A52 and the A72, in Taiwan and expects Taiwan's 5G users to reach more than 5.5 million or a penetration rate of over...
Suppliers of GaAs-based power amplifiers and RF components will be ready to kick off shipments of related 5G-enabled products for Apple's next-generation iPhone lineup by the end...
Taiwan's IC substrate suppliers will continue to enjoy robust shipments of BT-based FCCSP substrates for handset SoCs throughout first-quarter 2021, but may see off-season impacts...
Touch panel maker General Interface Solution (GIS) is expected to lock in the first batch of in-display ultrasonic fingerprint sensor module orders from Samsung Electronics for usage...
Android-camp handset vendors including Samsung Electronics are expected to follow in the footsteps of Apple in incorporating direct time-of-flight (dToF) CMOS image sensors (CIS)...
Taiwan's IC substrate makers Unimicron Technology and Kinsus Interconnect are poised to benefit significantly from 5G handset sales boom expected in 2021 as they reportedly have secured...
ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Samsung Electronics has cut its foundry quotes to attract 5nm chip orders including those for Qualcomm's new Snapdragon 888 processor series, according to industry sources.
Handset brands including Samsung Electronics, Xiaomi, Oppo and Vivo have stepped up their purchases of IC parts as they aim to take over the smartphone market share relinquished by...
