TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...

Generative AI is currently the hottest topic in the high-tech industry. To meet the massive computational power demands brought by generative AI, our clients are exploring various...

Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...

EDA tool provider Synopsys announced an acquisition of the simulation and analysis solution provider Ansys, a deal aimed at creating synergy between electronics and physics in an...

United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency,...

Electronic design automation (EDA) companies have sped up their development of 4nm radio-frequency IC (RFIC) designs.

At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...

Ansys and TSMC continue their long-standing technology collaboration to announce the certification of Ansys' power integrity software for TSMC's N2 process technology.