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Monday 2 September 2019
Keen competition to emerge in high-frequency CCL for 5G AAU applications
Demand for high-frequency and high-speed CCL will rise sharply to support production of multi-layer backboards for AAU (active antenna unit) application at 5G base stations, prompting...
Monday 26 August 2019
CCL, IC substrate and flexible PCB demand to boom in 5G era
Chip and component demand for 5G related applications, including network equipment, and antennas for handsets and IoT devices, is set to grow robustly starting 2020. In the PCB industry...
Thursday 22 August 2019
ABF substrate demand to stay robust through 2020
ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...
Tuesday 13 August 2019
ASE to buy new factory building to optimize capacity deployment
Taiwan's top backend house Advanced Semiconductor Engineering (ASE) has decided to purchase a new factory building in Kaohsiung, southern Taiwan to provide more space for warehousing...
Monday 12 August 2019
IC backend supply chain to thrive on 5G smartphone penetration
With Qualcomm aggressively offering multiple APs, baseband chips and RF front-end modules (FEMs) to tap the 5G smartphone market, its Taiwan-based backend service providers including...
Thursday 8 August 2019
High-end CCL demand from Huawei ramping up
High-end CCL demand from Huawei has been rising due to a major redesign of its 5G base station infrastructure, prompting Taiwan CCL makers to upgrade their CCL specs to meet the demand,...
Friday 2 August 2019
Notebook vendors gearing up to launch 5G models
The world's top-3 notebook vendors Lenovo, HP and Dell are set to introduce their first 5G models in the second half of 2019, and Apple is also expected to roll out its 5G MacBook...
Thursday 1 August 2019
ASE gaining ground in SiP on heterogeneous integration demand
Taiwan's top IC backend specialist ASE Technology Holding has seen its SiP (system in package) business expand substantially so far this year amid growing demand for heterogeneous...
Thursday 1 August 2019
Taiflex lowers 2019 revenue guidance on unclear order visibility
Taiwan-based Taiflex Scientific, a supplier of flexible copper-clad laminates (FCCL), has projected 2019 revenues to fall over 10% from 2018 due to unclear order visibility for the...
Monday 29 July 2019
Huawei gearing up 5G deployments via 3-pronged approach
Despite suffering hiccups in obtaining advanced 5G base stations chips from US suppliers, Huawei is still aggressively taking a three-pronged approach in carrying out its 5G deployments,...
Tuesday 23 July 2019
Chipmakers keen to roll out power-saving 5G chip solutions
As shipments of 5G network equipment and terminal devices are set to trend up steadily, major global chipmakers are all gearing up for close combats in the 5G chipset market by releasing...
Monday 22 July 2019
PCB supply chain upgrading tech specs for 5G smartphones
Taiwan PCB makers, boasting a significant presence in the supply chain of Apple, are quietly gearing up for specs upgrades on their products to support 5G smartphones, according to...
Friday 19 July 2019
Taiwan passive components makers actively moving to develop 5G RF, antenna products
Lackluster terminal market demand has prompted Taiwan's leading passive components makers Yageo and Walsin Technology to step up implementing new development roadmaps for the next...
Tuesday 25 June 2019
Taiwan flexible PCB firms have limited order visibility
Zhen Ding Technology and Flexium Interconnect, both of which are reportedly among the flexible PCB suppliers of Apple, see low order visibility, according to industry sources.
Wednesday 19 June 2019
FPCB maker Flexium tapping 5G, IoT application opportunities
Flexible PCB specialist Flexium Interconnect is looking to explore more application opportunities for its products beyond handsets, especially those for use in 5G and IoT devices,...