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Tuesday 13 January 2026
Laster Tech sees 4Q25 shipment growth, adopts strategic order approach in China
Benefiting from increased shipments of new and existing electric vehicle (EV) models, LED automotive lighting module maker Laster Tech reported consolidated revenue of NT$2.201 billion...
Tuesday 13 January 2026
Edge AI devices drive 2026 component value surge

CES 2026, themed "AI Forward," signaled a shift by global tech giants from generative AI models and computing power toward physical AI...

Tuesday 13 January 2026
CES 2026: Microip showcases vision tech for transit and drones
Microip, a Taiwan-based chip and system developer, used CES 2026 to highlight its move beyond standalone silicon, presenting a vision-based artificial intelligence platform that combines...
Tuesday 13 January 2026
Winbond Electronics and Transcend report strong growth as memory shortage
Memory chip manufacturers Winbond Electronics and Transcend Information posted significant profit increases in late 2025, driven by heightened demand and ongoing supply constraints...
Monday 12 January 2026
HP seeks Chinese memory suppliers as DRAM shortage bites
HP is reportedly evaluating Chinese memory suppliers as a global shortage of DRAM tightens supply for consumer devices, according to analyst commentary citing discussions with Bank...
Monday 12 January 2026
Synnex reports strong December revenue growth driven by memory prices and AI demand
Distribution giant Synnex Technology International Corp. posted robust revenue growth in December 2025, benefiting from rising memory prices and increased demand for AI server applications...
Monday 12 January 2026
Flytech posts 9.3% revenue growth in 2025, eyes resilient operations in 2026
Despite facing dual challenges from currency fluctuations and rising supply chain costs throughout the year, industrial PC maker Flytech Technology demonstrated strong market adaptability...
Monday 12 January 2026
Samsung reclaims top spot in global DRAM market with record quarterly revenue
Samsung Electronics has reclaimed its position as the world's leading DRAM supplier in the fourth quarter of 2025, reporting record revenue of KRW27.7 trillion (US$19.2 billion) in...
Monday 12 January 2026
AGC completes restructuring by exiting small glass substrate business for mobile phones
Japanese glass manufacturer AGC Corporation announced the completion of a major restructuring initiative, exiting the small-glass-substrate business for mobile phones. This move signals...
Monday 12 January 2026
Taiwan UPS specialist powers AI and semiconductor demand surge into 2026

Changs Ascending Enterprise Co. (CAEC) reported strong shipments of its next-generation lithium iron phosphate (LFP) UPS battery systems...

Monday 12 January 2026
Weekly news roundup: AI memory effects in DRAM, HBM4, and TSMC's global expansion
Below are the most-read DIGITIMES Asia stories of the first full week of 2026: January 5-11.
Monday 12 January 2026
Honey Hope Honesty posts 16% growth on surging AI server MLCC demand
Electronic component distributor Honey Hope Honesty Enterprise (3H) reported December 2025 revenue of NT$652 million (US$20.63 million), up 52.01% year over year. The strong growth...
Monday 12 January 2026
TSMC expands advanced packaging, reportedly set to name first 'general plant manager'
TSMC is rapidly expanding its advanced packaging operations and is reportedly poised to appoint its first-ever "general plant manager" to oversee all facilities. The role is expected...
Monday 12 January 2026
Nvidia set to hit US$200 billion revenue milestone on Blackwell and China H200 chip sales
Nvidia CEO Jensen Huang emphasized strong AI computing demand at CES 2026, showcasing the latest products and technologies while dispelling AI bubble concerns. He highlighted continuous...
Monday 12 January 2026
Taiwan semiconductor manufacturing split in 2025: memory rebounds, AI anchors foundry growth
Taiwan's semiconductor manufacturing side turned in a distinctly split performance in December 2025. The month can be summed up as: AI keeping advanced logic and advanced packaging...