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Wednesday 21 October 2026
Cloud AI to drive chip growth in 2027 as Taiwan suppliers seek opportunities beyond weak consumer edge AI
Market expectations for cloud AI demand have generally remained bullish through 2028-2029, with order visibility extending clearly over the next two to three years. The outlook for...
Wednesday 21 October 2026
Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand
Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their...
Wednesday 21 October 2026
PCB material shortages persist as capacity expansion extends beyond 2029
Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...
Wednesday 21 October 2026
Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity
The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to...
Wednesday 21 October 2026
DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment
DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through...
Wednesday 21 October 2026
TSMC and others turn LCD plants into AI assets as LG Innotek weighs acquisition
Growing demand for AI servers, advanced packaging, and data centers is reviving interest in idle LCD plants, with companies acquiring and converting existing sites into semiconductor...
Wednesday 21 October 2026
SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor
The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.
Wednesday 21 October 2026
Memory costs weaken e-reader demand as E Ink cuts 2026 outlook
Surging memory prices are forcing e-reader makers to raise prices, weakening demand and clouding E Ink Holdings' 2026 outlook. E Ink has cut its revenue-growth forecast, while Netronix...
Wednesday 21 October 2026
AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
Wednesday 21 October 2026
Samsung reportedly shifts foundry focus to 4nm, 5nm as 2nm deals take longer
Samsung Electronics is increasingly relying on its 4nm and 5nm foundry processes to improve near-term profitability as negotiations with major customers for its next-generation 2nm...
Wednesday 21 October 2026
Advanced PCB drilling faces growing demand from AI and high-speed applications
Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA...
Wednesday 21 October 2026
Supermicro lifts quarterly sales estimate as AI demand outpaces forecasts
Supermicro expects quarterly revenue and gross margin to exceed its earlier guidance, citing stronger demand for AI platforms and a more favorable customer and product mix. The October...
Wednesday 21 October 2026
Samsung Electro-Mechanics wins KRW360.5 billion memory substrate deal as AI demand drives expansion
Samsung Electro-Mechanics has secured a KRW360.5 billion (US$271.8 million) long-term contract to supply package substrates for memory semiconductors, strengthening its position in...
Wednesday 21 October 2026
AI infrastructure faces four hurdles: Power, construction, technology, funding
At last week's SEMICON West 2026 industry outlook forum, research firms said investment in US AI data centers continues to accelerate, but the industry still faces multiple hurdles...
Tuesday 20 October 2026
Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...