CONNECT WITH US
NEWS TAGGED FAB
Tuesday 16 April 2024
Despite US subsidies, challenges just about to begin for TSMC and Samsung
TSMC and Samsung Electronics stand to gain from subsidies provided by the US government to a lesser extent, according to sources at semiconductor equipment companies.
Monday 15 April 2024
Samsung gets US$6.4 billion from CHIPS Act, promises to bring HBM and advanced packaging to Texas
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
Wednesday 10 April 2024
Japanese firms witness highest equipment investment surge in 35 years, fueled by AI semiconductor boom
The average growth of equipment investments by Japanese enterprises is projected to reach 8.5% during fiscal 2024 (April 2024-March 2025), marking the highest surge since 1989, according...
Wednesday 10 April 2024
TSMC to expand collaboration with Japanese academia to nurture more talents
TSMC and Japan's Kumamoto University have announced a collaboration to cultivate semiconductor talent and conduct semiconductor research. Ever since TSMC built a wafer fab in Kumamoto...
Tuesday 9 April 2024
Advanced chips 100% made in US will be possible
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
Monday 8 April 2024
TSMC plans a third fab in Arizona and to receive up to US$6.6 billion in Chips Act funding
TSMC today announced that the US Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding...
Monday 8 April 2024
Japanese Prime Minister visits JASM fab in Kumamoto
Japanese Prime Minister Fumio Kishida visited Japan Advanced Semiconductor Manufacturing (JASM), a Taiwan Semiconductor Manufacturing Company (TSMC) subsidiary in Kumamoto, Kyushu,...
Wednesday 3 April 2024
PSMC chair touts 'Fab IP' business model
Powerchip Semiconductor Manufacturing (PSMC) has created a "Fab IP" business model to help various countries establish their semiconductor manufacturing sectors, according to the...
Friday 29 March 2024
Sony opens new CMOS image sensor fab in Thailand
Sony inaugurated an expanded facility in central Thailand, which will make automotive CMOS image sensors (CIS), OLED display components for digital cameras, and laser diodes for high-capacity...
Friday 29 March 2024
SK Hynix to break ground for state-backed advanced Yongin memory fab in 1Q25
SK Hynix is slated to officially break ground in March 2025 for a new advanced memory plant in Yongin, South Korea.
Friday 29 March 2024
TSMC plans A14 process manufacturing in Kaohsiung, say sources
TSMC has revised its new fab project in Kaohsiung, southern Taiwan, by adding two more phases of expansion for 1.4nm (A14) process manufacturing, according to sources at fab tool...
Wednesday 27 March 2024
Taiwan wafer foundry industry, 1Q 2024

Introduction

Wednesday 27 March 2024
Research Insight: Intel obtains subsidies but faces challenges
Vying for government subsidies would be the easiest assignment for Intel when it comes to expanding its foundry business, DIGITIMES Research believes.
Friday 22 March 2024
Vanguard International rumored to evaluate first 12-inch fab in Singapore
After experiencing inventory adjustments and a downturn in demand in the semiconductor market from the second half of 2022 to the end of 2023, Fang Leuh, the Chairman of Vanguard...
Wednesday 20 March 2024
SEMI expects record US$137 billion in 300mm fab equipment spending in 2027
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027, after topping US$100 billion for the first time in 2025, driven...