To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...
Alliance Material, a semiconductor materials company, reported a surge in revenue in August 2025, reaching NT$67.93 million (US$2.23 million), a 15.84% increase from July and nearly...
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies...
Innolux regards fan-out panel-level packaging (FOPLP) as a major strategic transformation, but its mass production schedule has been repeatedly delayed. During this process, high-level...
Taiwanese display maker Innolux has officially entered volume production of its fan-out panel-level packaging (FOPLP) technology, a cornerstone of its broader transformation strategy...
Memory packaging and testing company Powertech Technology Inc. (PTI) has heavily invested in fan-out panel-level packaging (FOPLP) in recent years. Chairman DK Tsai stated that the...
With China's domination in the global LCD panel industry, coupled with long-term overcapacity in panel production and the fact that higher-generation fabs are more efficient and cost-effective...
Taiwan's Innolux has completed a senior management restructuring following the departure of key executives, with the company accelerating plans to close its fifth-generation display...
SEMICON Taiwan 2025 is scheduled to take place from September 10 to 12 at the Taipei Nangang Exhibition Center, with a series of technical forums kicking off on September 8. A key...
ThinTech Materials Technology (TTMC), a subsidiary of China Steel Corporation, experienced conservative shipment momentum in the first quarter of 2025 due to delays in customer verification...
Taiwanese chipmakers TSMC and ASE Holdings are quietly positioning themselves at the forefront of panel-level packaging (PLP), an emerging advanced packaging format poised to succeed...
Market sources report that SpaceX, the low-earth orbit satellite giant founded by Tesla CEO Elon Musk, is accelerating its expansion into fan-out panel-level packaging (FOPLP). The...
While rival Innolux accelerates its push into FOPLP with plans for mass production in late 2025, AUO is taking a more cautious path. CEO and President Frank Ko explained that, despite...
