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    NEWS TAGGED FOPLP
    Thursday 8 May 2025
    Innolux strengthens leadership as it accelerates transformation beyond display panels

    Innolux Corporation, one of the world's leading panel manufacturers, held its annual general meeting this week. During the meeting, shareholders...

    Saturday 3 May 2025
    PTI sees operational rebound as memory and AI markets recover in 2025
    Memory testing firm expects growth following first-quarter trough, expands advanced packaging capabilities amid semiconductor market recovery
    Monday 28 April 2025
    FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

    As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

    Thursday 17 April 2025
    Innolux CEO responds to FOPLP delays
    Innolux, a major display panel maker, is intensifying its push into Fan-Out Panel Level Packaging (FOPLP), a next-gen semiconductor packaging technology. While the company is positioning...
    Friday 21 March 2025
    China steel unit expands semiconductor business, eyes biomedical growth
    Thintech Materials, a subsidiary of China Steel Corporation, is ramping up its semiconductor operations with expected significant growth by 2025, driven by target and evaporation...
    Monday 17 March 2025
    Innolux targets panel packaging mass production among delays
    Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays. As the first quarter...
    Wednesday 19 February 2025
    ASE and PTI step up FOPLP investments to tap AI boom
    ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
    Friday 10 January 2025
    Innolux reports 2.3% revenue growth in 2024, expands into non-display sectors in 2025
    Innolux Corporation reported 2024 consolidated revenue of NT$216.5 billion (US$6.58 billion), marking a 2.3% increase from the previous year, underscoring the company's strategic...
    Wednesday 25 December 2024
    Samsung, TSMC diverge on panel materials for advanced packaging
    Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience...
    Tuesday 24 December 2024
    Innolux charts course into FOPLP amid market headwinds
    Amid intense competition from Chinese suppliers and a maturing consumer electronics market, Taiwan-based panel provider Innolux is pursuing transformation through its "More than Panel"...
    Monday 23 December 2024
    Innolux seeks assistance to advance FOPLP technology
    Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
    Monday 23 December 2024
    Innolux expands semiconductor footprint with FOPLP and silicon photonics
    Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out panel-level packaging (FOPLP) to include silicon photonics...
    Tuesday 17 December 2024
    Innolux expects revenue boost from new IAS business unit
    Taiwanese panel maker Innolux has established its Intelligent Automation Solutions (IAS) Business Center, which focuses on three major product lines targeting smart manufacturing...
    Thursday 12 December 2024
    Phoenix Pioneer sees a bright outlook for 2025 amid its transition to advanced packaging substrates
    Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead...
    Wednesday 11 December 2024
    CMMT pushing into FOPLP product business
    Polarizer specialist Cheng Mei Materials Technology (CMMT) is collaborating with customers on films, adhesives, and coatings for the fan-out panel-level packaging (FOPLP) backend...
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    Veeam Q2 Vault – ANZ
    BIZ FOCUS
    May 5, 17:05
    Femtum pioneers advanced laser solutions for semiconductor manufacturing, eyes expansion in Taiwan
    Monday 5 May 2025
    Clirio revolutionizes infrastructure management with augmented reality and 3D visualization
    Monday 5 May 2025
    Letenda pioneers innovation in electric bus manufacturing
    Monday 5 May 2025
    Pushing boundaries: Voice AI and LLMs meet edge computing
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES