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NEWS TAGGED FOPLP
Tuesday 5 November 2024
AUO pivots to silicon photonics over FOPLP race
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
Tuesday 5 November 2024
Micro LED's massive application potential reaches turning point, says AUO chairman
As AUO (AU Optronics) undergoes a strategic transformation, the company maintains a cautious stance on fan-out panel level packaging (FOPLP) but shows increased optimism about silicon...
Wednesday 30 October 2024
PTI leverages FOPLP and HBM momentum as AI revenue share grows
Powertech Technology (PTI), a backend service provider, anticipates that orders for AI device applications will constitute a larger portion of the company's revenue. This is attributed...
Monday 28 October 2024
Innolux leads with copper-acid electrolysis in green recycling push
Innolux has gained attention for entering fan-out panel-level packaging (FOPLP). The Ministry of Environment recently commended the company for its resource recycling efforts, highlighting...
Friday 25 October 2024
Tongtai expands semiconductor presence with PCB, FOPLP solutions
Tongtai Machine & Tool is intensifying its expansion into the semiconductor sector, targeting automotive, aerospace, medical, and electronic semiconductors. The company forecasts...
Friday 25 October 2024
NEMStek lands plasma equipment orders for FOPLP
Nano Electronics and Micro System Technologies (NEMStek), a developer of plasma technologies and surface treatment solutions, has entered the supply chains of Chinese and Taiwanese...
Friday 18 October 2024
Rumors of factory sales resurface, Innolux states there are no existing plans
Following the sale of its Fab 4 to TSMC, rumors have emerged that Innolux may soon sell additional factories to TSMC, causing unease among employees and the supply chain. In response,...
Wednesday 16 October 2024
AUO dismisses speculation about FOPLP deployments
Taiwan-based LCD panel maker AU Optronics (AUO) has dismissed speculation that it is planning to establish a foothold in semiconductor packaging by developing FOPLP.
Tuesday 15 October 2024
OSATs budget more capex in 2024 than 2023
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Wednesday 25 September 2024
Innolux expands FOPLP focus beyond automotive, PMIC
Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.
Friday 13 September 2024
Nvidia AI chip supply chain grows amid market skepticism
The supply chain for Nvidia's AI processors continues to evolve and expand, despite recent negative market sentiment, according to industry sources.
Thursday 12 September 2024
Mirle strategically enters FOPLP, glass substrates, sparking rapid surge in orders
Mirle has achieved significant progress in its semiconductor equipment systems operations recently. As the semiconductor sector has experienced a notable surge in growth momentum,...
Wednesday 11 September 2024
Panel makers pivot to chip packaging as consumer electronics stall
With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting...
Tuesday 10 September 2024
Advanced packaging focuses on CoWoS, 3D IC, and FOPLP at SEMICON Taiwan 2024
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
Monday 9 September 2024
Equipment makers anticipate golden decade as FOPLP set for mass production in 2H25
SEMICON Taiwan 2024 has just concluded, and industry observers have noted one key difference compared to previous years: the number of equipment manufacturers participating, which...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research