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NEWS TAGGED FOPLP
Tuesday 16 June 2026
TSMC PLP timeline faces skepticism from Taiwan industry sources

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

Monday 15 June 2026
CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

Saturday 13 June 2026
Linkotech: FOPLP rollout is gaining early traction

Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit...

Friday 15 May 2026
Panel makers cool in April 2026, pivot to CPO and FOPLP
After the early pull-forward effect from customers began to fade, Taiwan's panel makers have started to show signs of slower operating momentum. Weaker demand for consumer electronics...
Wednesday 13 May 2026
Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...
Tuesday 12 May 2026
Innolux shares surge on reports of potential TSMC FOPLP partnership
Unlike AUO, which remained in the red in the first quarter of 2026, Innolux returned to operating profitability, posting net income of NT$1.79 billion (approx. US$56.9 million) for...
Wednesday 29 April 2026
Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...
Monday 27 April 2026
Innolux enters leading tier of advanced packaging with new RDL and TGV technology
Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
Friday 10 April 2026
Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...
Friday 10 April 2026
AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth
AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...
Tuesday 7 April 2026
FOPLP and WMCM emerge as key to fan-out packaging competitive field
The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
Wednesday 1 April 2026
Taiwan panel leaders pivot: AUO targets CPO, Innolux advances FOPLP
Taiwan's panel industry is undergoing a collective transformation, with its two major players adopting distinct technology paths.
Friday 20 March 2026
Commentary: Taiwan's display panel makers are quietly becoming chip companies
Taiwan built its technology identity on two pillars: semiconductors and display panels. One has thrived. The other is reinventing itself.
Monday 9 March 2026
LCD TV panel prices rise in 1Q26 as demand stays strong
After the Lunar New Year, LCD TV panel prices have continued to climb, driven by inventory buildup for sports events and rising costs. This momentum pushed February's LCD TV panel...