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    NEWS TAGGED FOPLP
    Wednesday 24 June 2026
    Global market for advanced chip packaging set for rapid expansion
    The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
    Thursday 18 June 2026
    FOPLP race heats up as Innolux reportedly teams with TSMC
    As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
    Tuesday 16 June 2026
    TSMC PLP timeline faces skepticism from Taiwan industry sources

    A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

    Monday 15 June 2026
    CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

    Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

    Saturday 13 June 2026
    Linkotech: FOPLP rollout is gaining early traction

    Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit...

    Tuesday 2 June 2026
    Display to semiconductor: Panel makers weaponize large glass substrates for FOPLP

    Introduction

    Friday 15 May 2026
    Panel makers cool in April 2026, pivot to CPO and FOPLP
    After the early pull-forward effect from customers began to fade, Taiwan's panel makers have started to show signs of slower operating momentum. Weaker demand for consumer electronics...
    Wednesday 13 May 2026
    Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
    South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...
    Tuesday 12 May 2026
    Innolux shares surge on reports of potential TSMC FOPLP partnership
    Unlike AUO, which remained in the red in the first quarter of 2026, Innolux returned to operating profitability, posting net income of NT$1.79 billion (approx. US$56.9 million) for...
    Wednesday 29 April 2026
    Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
    Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...
    Monday 27 April 2026
    Innolux enters leading tier of advanced packaging with new RDL and TGV technology
    Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
    Friday 10 April 2026
    Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
    Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...
    Friday 10 April 2026
    AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth
    AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...
    Tuesday 7 April 2026
    FOPLP and WMCM emerge as key to fan-out packaging competitive field
    The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
    Wednesday 1 April 2026
    Taiwan panel leaders pivot: AUO targets CPO, Innolux advances FOPLP
    Taiwan's panel industry is undergoing a collective transformation, with its two major players adopting distinct technology paths.
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook