AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...
Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, reported record-breaking performance despite earlier regulatory...
Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid...
In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...
Taiwan's two major panel makers posted their highest combined revenue in four years in 2025, with December showing both month-over-month and year-over-year growth. As China now dominates...
Chairman Jim Hung said Innolux will deprioritize shipment volume for its fan-out panel-level packaging (FOPLP) business in 2026, shifting its focus to redistribution layer (RDL) and...
Elon Musk, owner of SpaceX and Tesla Inc., is making significant strides to develop a comprehensive semiconductor manufacturing supply chain in the US. Sources indicate that the fan-out...
Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
DDR4 memory is experiencing a sharp rise in both price and volume due to tight supply, driving strong inventory replenishment momentum. This has rapidly heated up orders across the...
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September 9,...
Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...
Alliance Material, a semiconductor materials company, reported a surge in revenue in August 2025, reaching NT$67.93 million (US$2.23 million), a 15.84% increase from July and nearly...
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies...
Innolux regards fan-out panel-level packaging (FOPLP) as a major strategic transformation, but its mass production schedule has been repeatedly delayed. During this process, high-level...
