PCB and IC substrate manufacturer Unimicron Technology slipped into the red in the fourth quarter of 2013, and has expressed caution about its business outlook for first-quarter 20...
The rise of China's PC, smartphone and LCD TV industries has triggered heavy investments, and consequently sustained growth for the PCB supply chain in China, enabling China-based...
Major Taiwan-based HDI board suppliers, including Unimicron Technology, Compeq Manufacturing, and Unitech Printed Circuit Board are cautious about implementing capacity ramp projects...
Taiwan-based suppliers of HDI boards, flexible PCBs and flexible copper clad laminates (FCCLs) are set to enjoy brisk sales in 2014 thanks to strong demand from China-based handset...
Tripod Technology expects its fourth-quarter sales to stay flat on quarter. Falling orders for conventional PCs and TVs will be offset by steady growth in those for automotive and...
PCB maker Compeq Manufacturing is expected to see its revenues hit a new high in the fourth quarter of 2013, buoyed by strong demand for HDI boards from smartphone vendors, according...
Unitech Printed Circuit Board is likely to maintain its capex budget for 2014 at NT$1.5 billion (US$51.1 million), mainly for ramping up its production capacity of HDI and rigid-flex...
Orbotech Pacific Ltd., the Asia Pacific subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC...
Demand for any-layer HDI PCBs has been weaker-than-expected since the third quarter of 2013 as high-end smartphone sales have been disappointing, according to industry sources.
PCB makers Compeq Manufacturing, Unitech Printed Circuit Board and Unimicron Technology have been ramping up the production of any-layer HDI boards, eliminating the likelihood of...
The production value of PCBs produced by Taiwan-based companies in Taiwan and China is forecast to decrease 3.06% to NT$499.6 billion (US$16.68 billion) in 2013, according to the...
Unitech Printed Circuit Board has shifted 50% of its total HDI board capacity to any-layer products, and continues to invest aggressively in improving its manufacturing process for...
PCB maker Unimicron Technology has set a capex budget of NT$10-11 billion (US$331.5-364.7 million) for 2013, mainly to develop thinner, high-density chip-scale package (CSP) substrates,...
Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...
