News tagged IC design, distribution at DIGITIMES

NEWS TAGGED IC DESIGN, DISTRIBUTION

Tuesday 22 September 2026

MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices

MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery...

Tuesday 22 September 2026

MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook

MediaTek has launched the Dimensity CX C10 Max, the first chip in a new family called Dimensity Compute Experiences (CX), and is aiming it at Googlebook laptops.

Tuesday 22 September 2026

AI inference demand surges as training slowdown talk fades

Calls to slow frontier AI model training have sparked debate across the AI semiconductor industry, but executives at the AI Infra Summit in Santa Clara, California, said the real buildout...

Monday 21 September 2026

Rebellions chips process over 4 billion tokens a day for SK Telecom

South Korean AI chipmaker Rebellions has expanded its neural processing units (NPUs) across four commercial SK Telecom services, with the infrastructure now processing about 14 million...

Monday 21 September 2026

India roundup: Semicon India 2026 puts commercial production and supplier investment in focus

India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...

Friday 18 September 2026

Winbond cements server NOR lead with Infineon deal

Winbond Electronics is expanding its NOR Flash footprint and has agreed to pay US$1.12 billion in cash to acquire Infineon's NOR Flash and F-RAM businesses, a move that will lift it...

Friday 18 September 2026

Corning to raise display glass substrate prices 15% from 4Q26

Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026,...

Friday 18 September 2026

Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026

Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs

The multinationals that filled Semicon India 2026 committed to almost every layer of the semiconductor value chain except the one India most wants: nobody announced a new fab. Applied...

Friday 18 September 2026

Modi says India's chip mission has reached commercial production as Semicon 2.0 lifts the purse to US$13.5 billion

India's government used the opening of Semicon India 2026 to reframe what it is asking the industry to believe: not that fabs will be built, but that they are already shipping. Prime...

Friday 18 September 2026

Apple and MediaTek's latest SoCs address overkill performance by reserving space for agentic AI

Apple unveiled its iPhone 18 Pro series featuring its inaugural 2nm smartphone silicon, the A20 Pro, which was followed by MediaTek's announcement of its own 2nm Dimensity 9600 Pro...

Thursday 17 September 2026

AMD pivots to China developer ecosystems as Nvidia retreats

As Nvidia gradually retreats from China's high-end AI accelerator market amid strict US export controls, Advanced Micro Devices (AMD)...

Thursday 17 September 2026

The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table

The relationship between Nvidia CEO Jensen Huang and US President Donald Trump has evolved from policy friction to a strategic alignment. The rapid shift in their dynamic reflects...

Thursday 17 September 2026

Tier IV open-sources self-driving AI chip design to challenge Nvidia

Japanese autonomous driving developer Tier IV is developing an AI chip and will release its chip design and related toolchain as open...

Thursday 17 September 2026

Samsung expands SRAM, IP to speed chip development

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster...

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Nov 13, 08:00

APD Opens Shenzhen Facility, Advancing Dual-Plant Integration and Smart Manufacturing

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