Amid rising offshore wind power development in Taiwan and across Asia, alongside increasing cross-border communication cable installations, Dong Fang Offshore (DFO) is aggressively...
Power semiconductor maker Panjit International is positioning itself to capitalize on the booming demand from AI data centers, targeting fast growth in AI, cooling, and power supply...
At the annual Taipei International Book Exhibition — traditionally a peak season for e-reader launches and promotions — E Ink Holdings, the world's largest e-paper material...
The RISC-V ecosystem is making steady progress across various application fields, from cloud high-performance computing to automotive electronics. Industry players are launching solutions...
The server industry is reaping the benefits of AI. Quanta's revenue hit a record high in 2025, surpassing the NT$2 trillion (US$63.2 billion) mark, with AI servers as the primary growth...
Post-pandemic inventory digestion for mature semiconductor processes has come to an end. Market conditions have rebounded amid tariff-hedging and precautionary stocking, driving Taiwan's...
On December 30, Chinese AI company Z.ai launched a share sale to raise HK$4.35 billion (approx. US$560 million), aiming to become the first large language model (LLM) developer listed...
J.K. Wang, a veteran leader in the semiconductor industry and former COO of TSMC, shared insights on TSMC's large-scale wafer fab mass production during his first media interview since...
Former COO of TSMC and a veteran semiconductor industry leader, J.K. Wang, shared insights from his 30-plus-year career at the company in an exclusive interview with DIGITIMES'...
Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang...
Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
Qualcomm is hosting another summit with Taiwan's local PC ecosystem by the end of 2025, following its 2023 event. Kedar Kondap, Qualcomm's senior vice president responsible for PC...
Cybercriminal networks are evolving rapidly as artificial intelligence (AI) reshapes the landscape of cyber threats. Derek Manky, vice president of global threat intelligence at Fortinet,...
