Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed...
Foxconn Electronics (Hon Hai Precision Industry) will acquire a land plot in Kaohsiung for building a smart plant to make servers and related products, as part of its efforts to enhance...
Foxconn Electronics (Hon Hai) plans to set up a global data center in Kaohsiung, southern Taiwan, with the center to process and store data for Foxconn Group's clients and members...
Flexible PCB maker Flexium Interconnect has kicked off construction of a new plant in Kaoshiung, southern Taiwan, which will serve as the firm's 5G smart communication business operating...
The Ministry of Economic Affairs (MOEA) has begun a project to rebuild part of the Kaohsiung Export Processing Zone (EPZ) in southern Taiwan into a smart manufacturing base.
Taiwan's Cross-Border Innovation and Entrepreneur Association (CIEA) will leverage its cross-border resources integration to help member tech startups explore business opportunities...
Winbond Electronics, a maker of specialty DRAM and flash memory, saw its December revenues fall to a 20-month low of NT$3.69 billion (US$119.6 million).
Discrete component vendor Vishay plans to make NT$2.61 billion (US$84.8 million) worth of investment in Kaohsiung, southern Taiwan for building additional production lines, and has...
The board of directors of flexible PCB specialist Flexium Interconnect has approved plans to budget NT$8 billion (US$259.5 million) in capex for 2019, which will be utilized for capacity...
Taiwan-based leadframe supplier Jih Lin Technology has established a new headquarters in Kaohsiung, southern Taiwan, and is looking to build additional production capacities at its...
Yageo has acquired about 21,000 square meters of land in Southern Taiwan for NT$790 million (US$25.7 million) in cash, according to the passive component vendor. The land will provide...
Winbond Electronics saw shipments of chips built using 38nm process technology ramp up substantially to account for 24% of the chipmaker's total DRAM sales in the third quarter of...
Advanced Semiconductor Engineering (ASE) under ASE Technology Holding is expected to make significant progress on its fan-out panel-level packaging (FOPLP) services in the first half...
Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according to the Kaohsiung city government.
Copper-clad laminate (CCL) supplier Iteq has announced consolidated revenues of NT$2.09 billion (US$67.8 million) for August 2018, up 9.2% on year and 4.4% sequentially.
