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NEWS TAGGED RENESAS
Thursday 1 April 2010
PSC to take up Vantel, develop NAND flash products in Taiwan
Powerchip Semiconductor Corporation (PSC) has revealed plans to take up all of the shares as well as technology of Vantel, a memory design joint venture with Renesas Technology in...
Wednesday 20 January 2010
IC distributors Koryo and Promate see profits jump in 2009
Koryo Electronics and Promate Electronics have both reported profit growth of 45% and 30%, respectively, on year for 2009. Koryo, which distributes semiconductor components for mostly...
Thursday 3 December 2009
Renesas Taiwan, Teco Electric sign MOU on 3D DSC platform development
Renesas Technology Taiwan and Taiwan-based Teco Electric & Machinery have announced cooperation to develop a 3D digital still camera (DSC) platform which is scheduled to debut...
Monday 16 November 2009
Chipbond affiliate in China suspends expansion plan pending rule changes
Chipbond Technology's China-based affiliate Chipmore Technology has suspended plans to expand capacity for gold bumping, pending possible changes to Taiwan government policies concerning...
Monday 21 September 2009
Samsung gains in handset applications processor chips courtesy of iPhone, says iSuppli
Samsung Electronics in the second quarter expanded its share of the global market for standalone applications processor chips used in handsets due to rising sales of Apple's iPhone,...
Thursday 17 September 2009
NEC Electronics and Renesas agree to merge
NEC Electronics and Renesas will integrate their operations and generate synergies to specialize in microcontroller unit (MCU), system-on-chip (SoC) and discrete products, according...
Tuesday 8 September 2009
Motherboard makers pessimistic about new CPU force from Japan
Taiwan-based motherboard makers hold a pessimistic attitude toward recent news that several Japan-based semiconductor players plan to form alliance to develop a new CPU architecture...
Wednesday 2 September 2009
Chipbond raises capex
Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional...
Tuesday 25 August 2009
Driver IC backend supplier Chipbond enjoys strong July profits
Chipbond Technology has posted net profits of NT$81 million (US$2.46 million) for July 2009 roughly equal to its net profits of NT$81.65 million for the second quarter.
Thursday 30 July 2009
Renesas aims at 20-30% share of small- to medium-size driver IC market in China
Renesas Technology has revamped its marketing strategy for the China market and teamed up with four Taiwan-based IC distributors to push sales of its driver ICs for small- to medium-size...
Monday 20 July 2009
Casio reportedly looking to sell gold-bumping equipment
Casio Micronics is looking to sell its gold-bumping equipment, as the Japan-based company already suspended operation of its gold bumping lines in April 2009 amid difficult times,...
Monday 22 June 2009
Japan IDMs outsourcing IC backend production to Chipbond
Renesas Technology is closing production lines and plans to release bump and chip on glass (COG) orders to Chipbond Technology, while NEC Electronics already started releasing chip...
Wednesday 29 April 2009
PSC expects Renesas-NEC merger to bring more cooperation for subsidiaries
Frank Huang, chairman of Powerchip Semiconductor Corporation (PSC), has said that he believes the merger of Renesas Technology and NEC Electronics will generate larger cooperation...
Thursday 23 April 2009
Renesas adds 16KB low-cost versions to expand SH/Tiny flash microcontrollers
Renesas Technology America has added 16KB flash versions to its line-up of low pin count SH/Tiny flash microcontrollers. The lower memory versions provide a more flexible and cost-effective...
Friday 17 April 2009
Renesas and NEC merger expected to benefit Taiwan IC distributors
Japan-based NEC Electronics is speculated to merge with Renesas Technology, to become the biggest microcontroller unit (MCU) supplier worldwide, according to market sources.