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NEWS TAGGED SEMICON TAIWAN 2023
Tuesday 19 September 2023
AI boom sparks silicon photonics applications
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Tuesday 19 September 2023
Co-founding Cadence and Synopsis: Q&A with UC Berkeley Prof. Alberto Sangiovanni-Vincentelli (Part 2)
Professor Alberto Sangiovanni-Vincentelli is a legend of the electronic design automation (EDA) industry, but his stories were seldom told. DIGITIMES Asia is privileged to have this...
Monday 18 September 2023
Can generative AI shorten China's IC design learning curve? Q&A with UC Berkeley Prof. Alberto Sangiovanni-Vincentelli (Part 1)
Alberto Sangiovanni-Vincentelli, professor and Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Science Department at the University of California, Berkeley,...
Monday 18 September 2023
Fujitsu combines quantum-inspired technology and AI in business applications
In a recent interview with DIGITIMES Asia, Fujitsu Executive Director of Strategic Alliance Unit Taisuke Iwai finds digital annealing is the game changer in the field of quantum co...
Tuesday 12 September 2023
Quantum startup IonQ seeks scale-up and control solutions in Taiwan to overcome challenges
Quantum computing, often considered the next frontier in computing technology, has garnered immense attention in recent years. While giants like Google and IBM have made significant...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Monday 11 September 2023
With heterogeneous integration technology constantly evolving, EVG sheds lights on hybrid bonding and NIL trends
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
Monday 11 September 2023
Advanced packaging and testing takes step in four major sectors, showcasing several high-end test interfaces
Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products...
Friday 8 September 2023
Inventec steps up automotive electronics deployment
Inventec has five certified production bases dedicated to automotive product manufacturing, enabling the company to establish a presence within the supply chains of automobile vendors...
Friday 8 September 2023
Infineon gearing up for automotive chip boom
Infineon Technologies is expanding its production capacity to meet the rising demand for semiconductors used in electric vehicles (EV) and other automotive applications over the next...
Friday 8 September 2023
Regionalization of semiconductor supply chain preventing dominance by any single region, says Merck executive
The semiconductor supply chain that has long depended on global division of labor is shifting toward regionalization, making it very difficult for anyone to dominate it, according...
Thursday 7 September 2023
Inaugural quantum forum at Semicon Taiwan highlights new tech apps, future development pathways
The inaugural Quantum Taiwan Forum, held on the opening day of SEMICON Taiwan 2023 running September 6–8 at the Taipei Nangang Exhibition Center, gathered experts from Fujitsu,...
Thursday 7 September 2023
UK sets up first national pavilion at SEMICON Taiwan to show tech strength
The British Office Taipei, the UK's Department for Business and Trade, and Innovate UK, the UK's national innovation agency, have jointly hosted the UK's first-ever pavilion at SEMICON...
Thursday 7 September 2023
ASE subsidiary USI sees Poland as first step of EMEA strategy
The 2023 EU-Taiwan Investment Partnership Forum on Semiconductor Clusters, taking place on Sep. 7 on the sidelines of SEMICON Taiwan, saw new dynamics injected following the passage...
Thursday 7 September 2023
TSMC expanding CoWoS packaging capacity
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research