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NEWS TAGGED SEMICONDUCTOR EQUIPMENT
Wednesday 3 August 2016
HMI shareholders OK acquisition by ASML
Shareholders of Hermes Microvision (HMI) have approved the proposed acquisition of the company by ASML, according to the Taiwan-based fab toolmaker.
Friday 22 July 2016
Gudeng lands wafer carrier orders from SMIC, says paper
Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer mainly specializing in mask solution products, has obtained wafer carrier orders from China-based...
Friday 22 July 2016
Fab tool book-to-bill slips
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.00 in June, down from 1.09 in May, according to SEMI.
Wednesday 13 July 2016
Chip equipment spending to stay flat in 2016, says SEMI
The worldwide semiconductor equipment market will register about flat growth in 2016, but is expected to rebound in 2017, according to SEMI.
Monday 20 June 2016
North American semiconductor equipment industry posts May 2016 book-to-bill ratio of 1.09, says SEMI
The book-to-bill ratio for the North America semiconductor equipment industry stayed above parity for the sixth consecutive month in May 2016, according to industry association SEM...
Wednesday 8 June 2016
HMI shareholders approve 2015 dividend of NT$16
Shareholders of Hermes Microvision (HMI), which provides electron beam (e-beam) inspection tools and solutions for the production of semiconductors, have approved the distribution...
Tuesday 7 June 2016
Global 1Q16 semiconductor equipment billings fall 13%, says SEMI
Worldwide semiconductor manufacturing equipment billings reached US$8.3 billion in the first quarter of 2016, according to SEMI. The billings figure is 3% higher than the prior quarter,...
Monday 25 April 2016
North American semiconductor equipment industry posts March 2016 book-to-bill ratio of 1.15
North America-based manufacturers of semiconductor equipment posted US$1.38 billion in orders worldwide in March 2016 (three-month average basis) and a book-to-bill ratio of 1.15,...
Friday 8 April 2016
Global 2015 semiconductor wafer-level manufacturing equipment market drops 1%, says Gartner
Worldwide semiconductor wafer-level manufacturing equipment revenue totaled US$33.6 billion in 2015, a 1% decrease from 2014, according to final results by Gartner. The top 10 vendors...
Wednesday 30 March 2016
TSMC orders equipment for NT$2.6 billion
Taiwan Semiconductor Manufacturing Company (TSMC) has purchased a batch of machinery and facility equipment from Jienshian Information Engineering, Lam Research International, Tokyo...
Friday 18 March 2016
North American semiconductor equipment industry posts February 2016 book-to-bill ratio of 1.05, says SEMI
North America-based manufacturers of semiconductor equipment posted US$1.26 billion in orders worldwide in February 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...
Tuesday 15 March 2016
SEMI reports 2015 semiconductor equipment sales of US$36.5 billion
SEMI has reported that worldwide sales of semiconductor manufacturing equipment totaled US$36.53 billion in 2015, representing an on-year decrease of 3%. Total equipment bookings...
Monday 14 March 2016
Front-end fab equipment spending to rise 3.7% in 2016, says SEMI
Front-end fab equipment spending (including new, used and in-house) is projected to increase 3.7% to US$37.2 billion in 2016, and will rise another 13% in 2017 to US$42.1 billion,...
Thursday 25 February 2016
North American semiconductor equipment industry posts January 2016 book-to-bill ratio of 1.08, says SEMI
North America-based manufacturers of semiconductor equipment posted US$1.32 billion in orders worldwide in January 2016 (three-month average basis) and a book-to-bill ratio of 1.08,...
Wednesday 27 January 2016
North American semiconductor equipment industry posts December book-to-bill ratio of 0.99, says SEMI
North America-based manufacturers of semiconductor equipment posted US$1.34 billion in orders worldwide in December 2015 (three-month average basis) and a book-to-bill ratio of 0.99,...