GlobalFoundries (GF) reportedly has quietly applied to US Securities and Exchange Commission for an IPO (initial public offering) listing on New York Stock Exchange in late 2021 or...
3M has introduced a new member of its high-strength hollow glass bubbles product line to provide a low-loss high-speed high frequency (HSHF) resin additive for composite materials...
Handset sales in Taiwan are expected to rise more than 30% sequentially in August after registering a nearly 20% increase in July, according to sources at the local retail channel.
The supply of 4G product chips including power amplifiers (PAs) and smartphone application processors has fallen short of demand due mainly to the chip suppliers' increased focus...
Phison Electronics is striving to strike deals with NAND flash chip providers for 2022 and finds it difficult to secure supply commitments from the memory chip vendors, according...
Taiwan-based HDI PCB manufacturers have seen orders surge significantly on seasonality for the mainstream handset, notebook, and other mass-market consumer applications, according...
Taiwan's IC distributors have scored impressive business results over the past months of the year thanks to persistently strong demand for diverse 5G, HPC, AIoT, and high-speed transmission...
Industry 4.0 is no longer a new concept, but there are always some parts of the manufacturing process that are so difficult to automate, including quality management or quality assurance...
More and more IC designers in Taiwan are keen to join the Foxconn-led MIH open EV platform and seek to cash in on the immense market demand for automotive chips, according to industry...
According to Counterpoint Research's Monthly Philippines Channel Share Tracker report, Chinese mobile phone maker Realme has become the top brand with the highest shipments and market...
A new wave of prosperity is taking place in the global semiconductor industry. Fabless chipmakers, foundries and backend houses have all seen their supplies fall short of customer...
OSATs with SiP (system-in-package) technology, including ASE Technology and ShunSin Technology, are poised to gain from the ever-growing SiP demand for integrating heterogeneous chips...
DRAM contract prices have risen at a slower pace in the third quarter, and are expected to stay flat or drop slightly in the fourth quarter, according to industry sources.
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