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IN THE NEWS
Wednesday 26 August 2020
Geared towards 5G mmWave: Q&A with Flexium chairman MC Cheng
Taiwan's flexible PCB specialist Flexium Interconnect has seen its business operations improve significantly, reportedly as a result of entering the supply chain of flexible MPI (modified...
Tuesday 25 August 2020
STSP expects 2020 revenues growth of 15.7% on TSMC 5nm fab production
Government-developed Southern Taiwan Science Park (STSP) expects its revenues for 2020 to grow 15.7% on year to NT$860 billion (US$29.3 billion), mainly driven by TSMC ramping up...
Tuesday 25 August 2020
SiP+FPCB may be adopted for iPhone battery modules
SiP (system in package) combined with flexible PCB may be gaining ground in the supply chain of Apple devices, as the vendor reportedly will adopt the combination for its 5G handset...
Monday 24 August 2020
TSMC makes 1 billionth defect-free 7nm chip
TSMC has marked the manufacture of the one-billionth good die on the foundry's 7nm technology, which means one billion functional, defect-free 7nm chips.
Monday 24 August 2020
Samsung stepping up efforts for advanced chip packaging
Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...
Monday 24 August 2020
Six pillars bolstering Moore's Law: Q&A with Intel chief architect Raja Koduri
At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...
Friday 21 August 2020
Taiwan 5G optical component shipments to China to slow down in August-September
Shipments of optical components by Taiwan's makers for 5G applications to China are likely to slow down in August-September as Chinese telecom operators are adjusting designs of some...
Friday 21 August 2020
IntelliEPI to start trial production of GaN epi wafers in September
Intelligent Epitaxy Technology (IntelliEPI), which supplies compound semiconductor epitaxial wafers, will start trial production of GaN epi wafers in September, seeking to tap the...
Friday 21 August 2020
MediaTek conducts public test of 5G satellite IoT data connection with Inmarsat
MediaTek has announced a successful field trial that transfers data through Inmarsat's Alphasat L-band satellite in Geostationary Orbit (GEO) 35,000 kilometers above the equator....
Thursday 20 August 2020
PSMC launches 3D WoW production for AI memory chips
Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...
Thursday 20 August 2020
Taiwan PCB output value up 3.4% in 1H20 despite headwinds
Taiwan's PCB industry recorded production of NT$298.1 billion (US$10.15 billion) in the first half of 2020, growing 3.4% on year despite impacts of the coronavirus pandemic and US-China...
Wednesday 19 August 2020
Taiwan PCB makers concerned about demand gap left by Huawei
Taiwan's PCB supply chain is trying to identify clients who may replace Huawei and HiSilicon, both of whom face tough US trade restrictions, according to industry sources.
Wednesday 19 August 2020
CHT, ASE, Qualcomm join forces to build first 5G mmWave smart factory in Taiwan
Chunghwa Telecom (CHT), ASE Technology Holding and Qualcomm Technologies will join forces to build Taiwan's first smart factory based on 5G mmWave designated enterprise networks in...
Wednesday 19 August 2020
IntelliEPI, IVWorks team up to develop GaN epi wafers
Taiwan-based Intelligent Epitaxy Technology (IntelliEPI) has teamed up with IVWorks of South Korea to jointly develop and market GaN epi wafers based on molecular beam epitaxy (MBE)...
Wednesday 19 August 2020
HiSilicon team in Taiwan shrinking
Huawei's chipmaking subsidiary HiSilicon has seen many of its staff in Taiwan leaving amid increasingly tough trade sanctions from the US on the Chinese tech group, according to industry...