Taiwan's major IC substrate makers Unimicron Technology and Nan YA PCB have stressed that their investments in capacity expansion and R&D for ABF substrates will not be affected...

Taiwan Star Telecom has signed a deal with Nokia for the buildup of its 5G base stations and central equipment systems of its 5G networks, according to a company statement.

Smartphone sales in China have been picking up recently, with strong consumer demand for 5G models fueling the momentum, according to sources from Taiwan's handset supply chain.

Pegatron, eyeing the business opportunities in enterprise-use private networks in the 5G era, is making preparations to produce devices for use in dedicated 5G networks for enterprise...

Far EasTone Telecommunications (FET) has disclosed it has completed proof of concept (POC) for drone-based 5G 3D spatial network optimization, a project intended to optimize spatial...

High inventory levels at clients in late 2019 and the coronavirus outbreak early this year combined to send first-quarter 2020 revenues of the world's top-2 silicon wafer suppliers...

MediaTek has announced a new Dimensity chipset for smartphones, the Dimensity 820, supporting 5G and the latest multimedia and AI technologies. The new offering portends keen competition...

Taiwan-based OSAT firms will continue to fulfill chip orders from Huawei/HiSilicon in the third quarter of 2020, but are unsure about the orders in the fourth quarter as the Chinese...

Chunghwa Telecom (CHT) and HTC have announced an alliance to jointly launch VR application services that will leverage the traits of high-speed, low latency and wide bandwidth of...

Taiwan's small- to medium-size panels shipments went down 28.4% sequentially in the first quarter of 2020, reaching only 167.64 million units as demand for entry-level smartphones...

Smartphone shipments to the China market in first-quarter 2020 plunged 51.9% from the prior quarter to reach the lowest single-quarter shipment volumes in recent years, as the market...

Nan Ya PCB returned to profitability in the first quarter of 2020, driven by strong shipments of its high-end ABF substrates.

VCSEL (vertical-cavity surface-emitting laser) chip demand for 5G base station equipment, networking devices and even optical communications applications has got on track for stable...

TSMC's in-house developed wafer-level integrated passive device (IPD) technology has been advanced to a new generation, which will be ready for high volume manufacturing this year,...

Cooling fan maker Power Logic expects the upcoming rollouts of 7nm GPUs by AMD and Nvidia to drive its shipments for high-end graphics cards in the second half of 2020.