MediaTek is on track to enter volume production of its first 5G SoC for sub-6GHz networks in January 2020, having begun sampling the chips in the third quarter of 2019, according...

Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...

Wafer test solution provider Chunghwa Precision Test Tech (CHPT) has announced the development of over-the-air (OTA) test solutions for mmWave 5G devices, including mmWave antenna-in-package...

TPCA Show 2019 will take place October 23 to October 25, 2019 at the Taipei Nangang Exhibition Center Hall 1 (TaiNEX 1). Themed on "5G Next," this year's exhibition will focus on...

The emerging AI, IoT and 5G applications will be stimulating related chip and component demand, with a rebound likely to take place in the memory market next year, according to market...

PCB manufacturers in the supply chain for Apple's iPhone 11 series are keeping a close eye on the new models' initial sales performance, which will determine their shipment momentum...

Huawei is stepping up purchases of IC substrates from its Taiwan-based suppliers, including Unimicron Technology and Nan Ya PCB, according to industry sources.

Semiconductor test equipment supplier Advantest is presenting its latest solutions for 5G, next-generation memory, automotive and power device applications during the Semicon Taiwan...

PCB manufacturer Unitech Printed Circuit Board has seen revenue contribution for rigid-flex board shipments rise from 30% in 2018 to 50% currently, thanks to strong orders for TWS...

Successful development of technology concerning 5G, which pomises considerable growth potential, will be key to catapulting Taiwan into a digital economy and smart island, according...

Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP)...

GaAs foundry Win Semiconductors plans to expand production capacity by around 5,000 6-inch wafers monthly in the second quarter of 2020 to meet ever-increasing compound semiconductor...

Apart from Samsung and Huawei, both of which rely heavily on chips developed in-house, other first-tier China-based smartphone vendors including Oppo, Vivo, Xiaomi and OnePlus are...

The lead time for production of 7nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended to nearly six months from the previous two months because of strong demand,...

The development of 5G networks including infrastructures, edging computers and end-market devices will significantly scale up global demand for heat-sink solutions in 2020 and beyond,...