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The imminent arrival of the 5G era promises great business opportunities for various sectors
IN THE NEWS
Thursday 8 November 2018
Catcher developing new casing materials, structures for 5G products
Catcher Technology is developing new casing materials and structures to meet higher performance requirements for casing products in the 5G era, as it aims to continue to sharpen its...
Thursday 8 November 2018
Qualcomm to better partner with TSMC for HPC chips fabrication
Qualcomm is expected to significantly enhance its partnership with Taiwan Semiconductor Manufacturing Company (TSMC) for the production of high-performance computing (HPC) chips for...
Wednesday 7 November 2018
IoT applications offer fertile soil for fostering unicorn startups, says professor
IoT applications can provide fertile soil for incubating unicorn startups, as long as startups can find key solutions in the process of developing creative IoT devices to satisfy...
Monday 5 November 2018
Ericsson offers WNC-made 5G devices for customer trials
Ericsson has taken a step to drive 5G commercial readiness by contracting Wistron NeWeb Corporation (WNC) to deliver 5G mobile devices for use in customer trials from the fourth quarter...
Friday 2 November 2018
Qualcomm to build three technology, testing centers in Taiwan
Qualcomm has announced that it will set up three technology and testing centers in Taiwan as it deepens its collaborative efforts with the local government and business concerns to...
Thursday 1 November 2018
Global foundry industry forecast, 2019 and beyond
The production value of the global foundry industry is expected to grow by a CAGR of 6.2% to reach US$81.94 billion in 2023, the final year of a five-year forecast period, driven...
Wednesday 31 October 2018
Taisol revenues hit record in 3Q18
Taiwan-based cooling module maker Taisol Electronics has reported consolidated revenues of NT$1.01 billion (US$32.33 million) for the third quarter, up 37% sequentially and 17% on...
Monday 29 October 2018
Samsung developing FOPLP for wearable devices
Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...
Friday 26 October 2018
Globalfoundries, Chengdu government realign JV strategy
Globalfoundries and the Chengdu municipality have signed an amendment to their investment and cooperation agreement. Based on market condition changes, Globalfoundries' renewed focus...
Thursday 25 October 2018
MLCC shipments for 5G applications may take off in 3-5 years
Taiwan MLCC suppliers are planning to enforce capacity expansions in the next two years to cash in on expected robust demand in the 5G era, but industry sources said it will take...
Wednesday 24 October 2018
Chipmakers advancing 5G chips rollout by one quarter
As leading brand vendors are set to roll out 5G-based smartphone models in the first half of 2019, chipmakers such as Qualcomm and MediaTek have advanced the launch schedules for...
Wednesday 24 October 2018
Qualcomm intros smaller 5G NR mmWave antenna module
Qualcomm Technologies has announced what it calls the smallest additions to its QTM052 mmWave antenna module family of fully-integrated 5G NR millimeter wave (mmWave) modules for...
Tuesday 23 October 2018
Chipmakers keen to expand 5G offerings beyond smartphones
As 5G commercialization is set to kick off in 2019, global chipmakers including Qualcomm, Intel, MediaTek and UNISOC (Spreadtrum & RDA) are looking to expand their 5G solutions...
Monday 22 October 2018
Global smartphone shipment forecast, 2019 and beyond
Digitimes Research estimates global smartphone shipments will not be able to break through the 1.5 billion unit mark by 2019 as 5G communication has yet to spur a wave of upgrades...
Friday 19 October 2018
Global notebook shipment forecast, 2019 and beyond
The notebook market will face unfavorable conditions in 2019 on both the supply side and demand side. Total shipments may dip further below the level seen in 2018.