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Wednesday 29 October 2025
Huawei Cloud on the back foot in China's AI race
Huawei Cloud is navigating one of its most turbulent periods yet. Confronted by internal and external headwinds—from a disciplinary probe and sweeping restructuring to a shrinking...
Tuesday 28 October 2025
Apple's 2026 foldable debut set to reshape US-China market dynamics
Samsung Electronics currently leads the foldable phone market and holds the largest share of foldable phone sales in the US, alongside Motorola and Google. However, Apple is expected...
Monday 27 October 2025
Weekly news roundup: TSMC tightens China orders; Micron sees DRAM market tightening; CXMT, Huawei advance HBM3 chips
Below are the top DIGITIMES Asia stories from October 20 to 26, 2025.
Monday 27 October 2025
As Huawei stumbles, ByteDance quietly rewrites China’s AI cloud order
Huawei Cloud CEO Zhang Ping'an and several top executives were recently demoted and had their salaries reduced, officially due to "performance falsification." The punishment, however,...
Sunday 26 October 2025
CXMT, Huawei align on HBM3 ahead of China's 2026 AI memory leap
High-bandwidth memory (HBM) has become the latest competitive front for global DRAM manufacturers. As Samsung, SK Hynix, and Micron gear up for HBM4 mass production in 2026, China's...
Wednesday 22 October 2025
Huawei's AI redemption: Richard Yu rallies global talent after PanGu fallout
As the US-China AI rivalry heats up, Huawei Executive Director and Chairman of the Board of Directors of the Consumer BG, Richard Yu, has announced a "Global Top AI Talent Recruitment...
Tuesday 21 October 2025
Huawei's HarmonyOS 6 targets AI-hardware convergence
Huawei's Terminal Business Group plans to unveil HarmonyOS 6, the latest version of its operating system, on October 22, 2025. Analysts see the launch as a signal of Huawei's push...
Monday 20 October 2025
Huawei Cloud CEO demoted over data falsification scandal
On October 18, 2025, Huawei's internal disciplinary committee reportedly imposed strict penalties on senior executives within its cloud computing business unit after uncovering "data...
Monday 20 October 2025
SiCarrier builds a new semiconductor arsenal: EDA tools, 3nm testing, and EUV patents
Shenzhen SiCarrier Technologies, a fast-rising semiconductor equipment firm closely linked to Huawei, is once again making headlines with a surge of breakthroughs and strategic moves...
Monday 20 October 2025
Exclusive: TSMC tightens China orders after US sanctions; Huawei proxy Sophgo cut off, Bitmain halved

Fueled by strong orders from Apple and Nvidia, TSMC posted record third-quarter results and raised its full-year US dollar revenue growth...

Saturday 18 October 2025
Huawei's Taiwan wearable sales grow 50% in AI-powered comeback
On October 16, 2025, Huawei launched several new products in Taiwan, including the WATCH GT 6 Pro, GT 6, and FreeBuds SE 4 ANC. Yong Hai, general manager of Xunwei Technology, Huawei's...
Tuesday 7 October 2025
Huawei overtakes Apple, topping global smartwatch market
Huawei smartwatches have recently seen a steady rise in sales in the Japanese market, particularly favored by middle-aged and elderly consumers. Retail channels indicate that since...
Tuesday 7 October 2025
TSMC, Samsung components still found in Huawei's Ascend 910C
Semiconductor intelligence firm TechInsights has concluded, following a teardown of Huawei Technologies' Ascend 910C chip, that some of the components still come from Taiwan Semiconductor...
Friday 3 October 2025
Nvidia's decades-long China strategy disrupted by deepening US-China tech rivalry
For years, Nvidia treated China as one of its most important growth markets, working closely with local partners to embed its GPUs into the country's AI ecosystem. From data centers...
Thursday 2 October 2025
Supernodes, not servers: How Alibaba, Baidu, Huawei are rewiring AI compute
At the Apsara Conference 2025, Alibaba introduced its PanJiu AI Infra 2.0 with a 128-chip supernode, the most-watched launch of the event. The debut underscores how China's cloud...
Monday 4 September 2017
IFA 2017: Huawei Kirin 970
Huawei has launched the Kirin 970 at IFA 2017 in Berlin, a chip that combines the power of the cloud with the speed and responsiveness of native AI processing, according to the company. Cloud AI has seen broad application, but user experience still has room for improvement, including latency, stability, and privacy, according to the vendor. Cloud AI and on-device AI can complement each other. On-device AI offers strong sensing capabilities, which are the foundation of understanding and assisting people. Sensors produce a large amount of real-time, scenario-specific, and personalized data. Supported by strong chip processing capabilities, devices will become more cognitive of user needs, providing personalized and readily accessible services. Kirin 970 is powered by an 8-core CPU and a new generation 12-core GPU. Built using a 10nm advanced process, the chipset packs 5.5 billion transistors into an area of only one square centimeter. Huawei's new flagship Kirin 970 is its first mobile AI computing platform featuring a dedicated neural processing unit (NPU). Compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970's new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency. The Kirin 970 can perform the same AI computing tasks faster and with far less power, Huawei claims. In a benchmark image recognition test, the Kirin 970 processed 2,000 images per minute, which was faster than other chips on the market. Huawei is positioning the Kirin 970 as an open platform for mobile AI, opening up the chipset to developers and partners.