Nakaya Microdevices, Amkor Technology and Toshiba Tuesday announced that they have signed a non-binding memorandum of understanding expressing their intent to form a joint venture in Japan that will provide system LSI assembly and testing services.

VLSI Research reported a 28.6% decline in probe card revenues in 2008, with the economic downturn and sharp cutbacks within the memory sector having "a seriously detrimental impact" on the market.

Bowing to what has long appeared inevitable, Japan lowered its growth forecast on Monday, projecting a 3.3% contraction for the fiscal year that began April 1.

Nokia Oyj will cut up to 360 jobs at Internet services unit as it combines offerings into its new Ovi Store, the world's top cell phone maker said on Tuesday. Nokia's new online software and multimedia store will challenge Apple's hugely successful App Store from May.

KLA-Tencor has announced operating results for its third quarter of fiscal 2009 (ended on March 31, 2009). KLA-Tencor reported a GAAP net loss of US$83 million and a GAAP loss per share of US$0.49 on revenues of US$310 million for the third quarter of fiscal 2009.

NEC Electronics and Renesas Technology have agreed to enter into negotiations to integrate business operations. The two chipmakers plan to sign an agreement at the end of July, 2009 to form Japan's largest semiconductor maker.

The government of India has signed an agreement with the One Laptop Per Child (OLPC) project and will purchase 250,000 of the organization's XO laptops. The machines will be distributed to students throughout the country. India's decision to embrace OLPC is a bit unexpected in light of the country's past antagonism towards the project.

Heat sinks, heat pipes and synthetic jets are among the technologies being used by LED fixture makers to remove heat from their products and enable them to operate correctly, reports Francoise Von Trapp.