REALTIME NEWS

IST gold bumping capacity to reach 180k in 2006

Amy Lee, Taipei

Dec 6, 2005, 11:51 0

International Semiconductor Technology (IST) expects its monthly gold bumping capacity to reach 180,000 8-inch equivalent wafers after its merger with Megic is completed at the end of the third quarter next year.

The article requires paid subscription. Subscribe Now

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.