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Winbond starts volume production at Taichung 12-inch fab

Press release, April 20; Esther Lam, DIGITIMES Asia Thursday 20 April 2006 0

Winbond Electronics today held an opening ceremony for a 12-inch wafer fab at the Central Taiwan Science Park (CTSP). The new fab consists of two wafer fabrication facilities, Fabs A and B, with mass production already underway at Fab A, which has a...

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