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Chipbond issues NT$2 billion CBs to fund solder bump expansion

MOPS, February 8; Esther Lam, DIGITIMES Asia Friday 9 February 2007 0

LCD driver IC testing house Chipbond Technology has announced it will issue a total of NT$2 billion (US$60.5 million) worth of convertible bonds (CBs) over five years, in an attempt to payback loans and purchase equipment, according to a company filing...

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