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Samsung claims heat dissipation reduction by 20% in new LCD driver IC package

Press release, February 1; Esther Lam, DIGITIMES Asia Thursday 1 February 2007 0

Samsung Electronics announced that its thermally-enhanced chip-on-film (TECOF) package for LCD driver ICs that are used in large-size and high-resolution LCD TVs could improve thermal heat dissipation by 20% over a conventional COF package, allowing...

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