Research Report Database

REALTIME NEWS

Upcoming Huawei smartphone with flagship Kirin SoC will be zoomed in again

Southeast Asia's digital economy slows as consumers cut spending

Silicon capacitors propel Semco toward high-performance markets

x86 Alliance takes shape as Intel and AMD join forces in AI era

Apple's US$280.8 million Chinese R&D expansion raises alarms for South Korean industry and US national security

OpenAI in regulator talks to become for-profit company

Home Tech Semiconductors

Chipbond and IST plan solder bump expansion

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia Monday 5 March 2007 0

LCD driver IC testing and packaging houses Chipbond Technology and International Semiconductor Technology (IST) both plan to extend their presence into the flip-chip (FC) solder bumping segment amid persistent price pressure for gold bumping.

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Tomorrow's Headlines.
Asia Supply Chain 250 dataset access.

Related news from other sites

Research Report Database

DotDot Global joins forces with AWS JIC to target global markets with food service technology

MOST-READ
7 DAYS NEWS